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Enabling IC Miniaturization: Global Plastics Leader Quadrant EPP Brings Innovative Solutions to Semicon West 2015


The Semiconductor industry continues to test Moore’s Law—the observation made in 1965 by Gordon Moore (co-founder of Intel) that the number of transistors per square inch on integrated circuits had doubled every year since the integrated circuit was invented. Moore predicted that this trend would continue for the foreseeable future.

With IC chips present in virtually every electronic device in the world. Moore’s prediction seems to be coming true. Over time, chips have become smaller, cheaper, and more powerful—the perfect storm for continued digital growth. Enter, Quadrant Engineering Plastic Products (EPP). 

Quadrant visits the Semicon West 2015 trade show July 14th–16th, 2015 to showcase its innovations in Engineering Plastic Materials for the Semiconductor and Electronics industries. These new materials are ideal for wet and dry semiconductor processing applications, and when compared to ceramic and quartz based materials, deliver increased performance at lower costs. 

Quadrant is the global leader in providing materials specifically engineered to exceed the requirements of the Semiconductor industry, offering distinct portfolios of machinable plastic shapes for wet process tool applications, CMP applications, plasma vacuum chamber applications, and back end test socket applications. Each specific material line is designed and developed to meet the changing needs of the Semiconductor industry driven by the miniaturization of the IC chip

Materials engineered by Quadrant for wet process provide solutions with a focus on purity, chemical resistance, and consistency:

• SYMALIT® PVDF & SYMALIT® ECTFE (with chemical resistance up to 300°F)
• SYMALIT® PFA (with chemical resistance up to 500°F)
• TECHTRON® PPS (delivering chemical resistance low outgassing at 425°F)
• KETRON® PEEK (the industry standard for PEEK shapes)

In addition, plasma chamber solutions such as Quadrant’s Semitron® MPR1000 deliver superior performance to Semiconductor applications in high energy, plasma rich environments—even in the most severe vacuum chamber conditions. 

Back end test socket materials developed by Quadrant offer unique properties that complement the miniaturization of the chip market. Quadrant’s test socket portfolio contains the following materials:

• SEMITRON® MDS 100 (non-fiber filler laminate)
• SEMITRON® MP 370 (increased machinability over ceramic filled PEEK)
• SEMITRON® ESd (full range of static controlled materials for the socket market)
• SEMITRON® GC-100 (a new product delivering ultra-high stiffness and extremely low CTE without the use of fibers, allowing for the machining of micro-holes drilling with extremely tight tolerance)

Quadrant’s materials make advancements in further miniaturization possible—using less material to do more means mobile phones, PCs, satellites, vehicles, and other devices can trend smaller as well as present competitive cost advantages. “We will continue to develop materials that present solutions that are both economical and practical for manufactures to go smaller,” states Scott Williams the Global Strategic Marketing Manager at Quadrant EPP.

See Quadrant’s innovative family of materials at Semicon West 2015 (booth #2117 in the South Hall of Moscone Center) in San Francisco, CA from July 14-16, 2015. Application specialists and technical experts will be available on-site to answer questions relating to the new material and to provide guidance for engineering and application solutions. 

Media Contact:

Kim Imes, Marketing

kim.imes(at)qplas.com | 610.320.6709